JPH0238169U - - Google Patents
Info
- Publication number
- JPH0238169U JPH0238169U JP11254388U JP11254388U JPH0238169U JP H0238169 U JPH0238169 U JP H0238169U JP 11254388 U JP11254388 U JP 11254388U JP 11254388 U JP11254388 U JP 11254388U JP H0238169 U JPH0238169 U JP H0238169U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- nozzle
- tip
- shutter
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11254388U JPH0238169U (en]) | 1988-08-27 | 1988-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11254388U JPH0238169U (en]) | 1988-08-27 | 1988-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238169U true JPH0238169U (en]) | 1990-03-14 |
Family
ID=31351577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11254388U Pending JPH0238169U (en]) | 1988-08-27 | 1988-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238169U (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119463U (en]) * | 1990-03-15 | 1991-12-10 | ||
| JPH07202404A (ja) * | 1993-12-29 | 1995-08-04 | Nec Corp | クリーム半田の塗布装置および方法 |
| JP2006130457A (ja) * | 2004-11-09 | 2006-05-25 | Nec Engineering Ltd | 半田ペースト塗布器 |
| WO2014128827A1 (ja) * | 2013-02-19 | 2014-08-28 | 富士機械製造株式会社 | 粘性流体補給器、粘性流体補給装置及び開閉部材 |
-
1988
- 1988-08-27 JP JP11254388U patent/JPH0238169U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119463U (en]) * | 1990-03-15 | 1991-12-10 | ||
| JPH07202404A (ja) * | 1993-12-29 | 1995-08-04 | Nec Corp | クリーム半田の塗布装置および方法 |
| JP2006130457A (ja) * | 2004-11-09 | 2006-05-25 | Nec Engineering Ltd | 半田ペースト塗布器 |
| WO2014128827A1 (ja) * | 2013-02-19 | 2014-08-28 | 富士機械製造株式会社 | 粘性流体補給器、粘性流体補給装置及び開閉部材 |
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